Reliability of the connections used in IGBT modules, in aeronautical environment

Reliability of the connections used in IGBT modules, in aeronautical environment

In this paper, two IGBT modules assembling technologies with double side cooling capabilities and high level of integration were proposed for aeronautic applications after a state of the art and failures analysis. These technologies are compared using design of experiment based on non-linear finite...

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Bibliographic Details
Main Authors: Zéanh A., Dalverny O., Karama M., Woirgard E., Azzopardi S., Bouzourene A., Casutt J., Mermet-Guyennet M.
Format: Article
Language:English
Published: EDP Sciences 2008-04-01
Series:International Journal for Simulation and Multidisciplinary Design Optimization
Subjects:
power electronic packaging
constitutive laws
failures criteria
fem
doe.
Online Access:https://www.ijsmdo.org/articles/smdo/pdf/2008/02/smdo2508.pdf

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