Reliability of the connections used in IGBT modules, in aeronautical environment

• Main Authors: Zéanh A., Dalverny O., Karama M., Woirgard E., Azzopardi S., Bouzourene A., Casutt J., Mermet-Guyennet M.
• Format: Article
• Language: English
• Published: EDP Sciences 2008-04-01
• Series: International Journal for Simulation and Multidisciplinary Design Optimization
• Subjects: power electronic packaging; constitutive laws; failures criteria; fem; doe.
• Online Access: https://www.ijsmdo.org/articles/smdo/pdf/2008/02/smdo2508.pdf
• ISSN: 1779-627X; 1779-6288

In this paper, two IGBT modules assembling technologies with double side cooling capabilities and high level of integration were proposed for aeronautic applications after a state of the art and failures analysis. These technologies are compared using design of experiment based on non-linear finite element analysis with various materials, with respect to their potential failures under thermal and power loading profiles. The configurations optimizing the lifetime and reliability level were pointed out by loading profile and failure mode. Recommendations were then done in order to choose the optimal configuration of assembly for each application. Finally, these design rules were followed by the study of parts dimensions effects on the design outputs in order to help dimensioning the IGBT modules.