Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

In relation to power converter design, power density is increasing while the form factor is decreasing. This trend generally reduces the rate of the cooling process, which increases the mutual thermal coupling among the surrounding power components. Most of the traditional models usually ignore the...

Full description

Bibliographic Details
Main Authors: Kaixin Wei, Tian Cheng, Dylan Dah-Chuan Lu, Yam P. Siwakoti, Chengning Zhang
Format: Article
Language:English
Published: MDPI AG 2019-08-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/9/16/3240

Similar Items