Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling
In relation to power converter design, power density is increasing while the form factor is decreasing. This trend generally reduces the rate of the cooling process, which increases the mutual thermal coupling among the surrounding power components. Most of the traditional models usually ignore the...
Main Authors: | Kaixin Wei, Tian Cheng, Dylan Dah-Chuan Lu, Yam P. Siwakoti, Chengning Zhang |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2019-08-01
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Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/9/16/3240 |
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