Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods

Three-dimensional (3D) measurement of microstructures has become increasingly important, and many microscopic measurement methods have been developed. For the dimension in several millimeters together with the accuracy at sub-pixel or sub-micron level, there is almost no effective measurement method...

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Bibliographic Details
Main Authors: Kepeng Chen, Tielin Shi, Qiang Liu, Zirong Tang, Guanglan Liao
Format: Article
Language:English
Published: MDPI AG 2018-11-01
Series:Sensors
Subjects:
Online Access:https://www.mdpi.com/1424-8220/18/11/3882
Description
Summary:Three-dimensional (3D) measurement of microstructures has become increasingly important, and many microscopic measurement methods have been developed. For the dimension in several millimeters together with the accuracy at sub-pixel or sub-micron level, there is almost no effective measurement method now. Here we present a method combining the microscopic stereo measurement with the digital speckle projection. A microscopy experimental setup mainly composed of two telecentric cameras and an industrial projection module is established and a telecentric binocular stereo reconstruction procedure is carried out. The measurement accuracy has firstly been verified by performing 3D measurements of grid arrays at different locations and cylinder arrays with different height differences. Then two Mitutoyo step masters have been used for further verification. The experimental results show that the proposed method can obtain 3D information of the microstructure with a sub-pixel and even sub-micron measuring accuracy in millimeter scale.
ISSN:1424-8220