Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module

In this paper, the broadband millimeter-wave waveguide package, which can cover the entire <i>W</i>-band (75&#8722;110 GHz) is presented and applied to build a low noise amplifier module. For this purpose, a broadband waveguide-to-microstrip transition was designed using an extended...

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Main Authors: Jihoon Doo, Woojin Park, Wonseok Choe, Jinho Jeong
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/8/5/523
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spelling doaj-8961e236f2ef457594c093f954e97d4a2020-11-24T21:44:53ZengMDPI AGElectronics2079-92922019-05-018552310.3390/electronics8050523electronics8050523Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier ModuleJihoon Doo0Woojin Park1Wonseok Choe2Jinho Jeong3Department of Electronic Engineering, Sogang University, Seoul 04107, KoreaDepartment of Electronic Engineering, Sogang University, Seoul 04107, KoreaDepartment of Electronic Engineering, Sogang University, Seoul 04107, KoreaDepartment of Electronic Engineering, Sogang University, Seoul 04107, KoreaIn this paper, the broadband millimeter-wave waveguide package, which can cover the entire <i>W</i>-band (75&#8722;110 GHz) is presented and applied to build a low noise amplifier module. For this purpose, a broadband waveguide-to-microstrip transition was designed using an extended <i>E</i>-plane probe in a low-loss and thin dielectric substrate. The end of the probe substrate was firmly fixed on to the waveguide wall in order to minimize the performance degradation caused by the probable bending of the substrate. In addition, we predicted and analyzed in-band resonances by the simulations that are caused by the empty spaces in the waveguide package to accommodate integrated circuits (ICs) and external bias circuits. These resonances are removed by designing an asymmetrical bias space structure with a radiation boundary at an external bias connection plane. The bond-wires, which are used to connect the ICs with the transition, can generate impedance mismatches and limit the bandwidth performance of the waveguide package. Their effect is carefully compensated for by designing the broadband two-section matching circuits in the transition substrate. Finally, the broadband waveguide package is designed using a commercial three-dimensional electromagnetic structure simulator and applied to build a <i>W</i>-band low noise amplifier module. The measurement of the back-to-back connected waveguide-to-microstrip transition including the empty spaces for the ICs and bias circuits showed the insertion loss less than 3.5 dB and return loss higher than 13.3 dB across the entire <i>W</i>-band without any in-band resonances. The measured insertion loss includes the losses of 8.7 mm-long microstrip line and 41.8 mm-long waveguide section. The designed waveguide package was utilized to build the low noise amplifier module that had a measured gain greater than 14.9 dB from 75 GHz to 105 GHz (&gt;12.9 dB at the entire <i>W</i>-band) and noise figure less than 4.4 dB from 93.5 GHz to 94.5 GHz.https://www.mdpi.com/2079-9292/8/5/523low noise amplifiermillimeter-wavepackagetransitionwaveguide
collection DOAJ
language English
format Article
sources DOAJ
author Jihoon Doo
Woojin Park
Wonseok Choe
Jinho Jeong
spellingShingle Jihoon Doo
Woojin Park
Wonseok Choe
Jinho Jeong
Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module
Electronics
low noise amplifier
millimeter-wave
package
transition
waveguide
author_facet Jihoon Doo
Woojin Park
Wonseok Choe
Jinho Jeong
author_sort Jihoon Doo
title Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module
title_short Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module
title_full Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module
title_fullStr Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module
title_full_unstemmed Design of Broadband W-Band Waveguide Package and Application to Low Noise Amplifier Module
title_sort design of broadband w-band waveguide package and application to low noise amplifier module
publisher MDPI AG
series Electronics
issn 2079-9292
publishDate 2019-05-01
description In this paper, the broadband millimeter-wave waveguide package, which can cover the entire <i>W</i>-band (75&#8722;110 GHz) is presented and applied to build a low noise amplifier module. For this purpose, a broadband waveguide-to-microstrip transition was designed using an extended <i>E</i>-plane probe in a low-loss and thin dielectric substrate. The end of the probe substrate was firmly fixed on to the waveguide wall in order to minimize the performance degradation caused by the probable bending of the substrate. In addition, we predicted and analyzed in-band resonances by the simulations that are caused by the empty spaces in the waveguide package to accommodate integrated circuits (ICs) and external bias circuits. These resonances are removed by designing an asymmetrical bias space structure with a radiation boundary at an external bias connection plane. The bond-wires, which are used to connect the ICs with the transition, can generate impedance mismatches and limit the bandwidth performance of the waveguide package. Their effect is carefully compensated for by designing the broadband two-section matching circuits in the transition substrate. Finally, the broadband waveguide package is designed using a commercial three-dimensional electromagnetic structure simulator and applied to build a <i>W</i>-band low noise amplifier module. The measurement of the back-to-back connected waveguide-to-microstrip transition including the empty spaces for the ICs and bias circuits showed the insertion loss less than 3.5 dB and return loss higher than 13.3 dB across the entire <i>W</i>-band without any in-band resonances. The measured insertion loss includes the losses of 8.7 mm-long microstrip line and 41.8 mm-long waveguide section. The designed waveguide package was utilized to build the low noise amplifier module that had a measured gain greater than 14.9 dB from 75 GHz to 105 GHz (&gt;12.9 dB at the entire <i>W</i>-band) and noise figure less than 4.4 dB from 93.5 GHz to 94.5 GHz.
topic low noise amplifier
millimeter-wave
package
transition
waveguide
url https://www.mdpi.com/2079-9292/8/5/523
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