THERMAL PERFORMANCE PREDICTION OF PLASTICS BALL GRID ARRAY (PBGA) USING ARTIFICIAL NEURAL NETWORK

Artificial Neural Network (ANN) based on feed-forward backpropagation model is used  to predict junction temperature in PBG A package. The limited results obtained from FEM (using IDEAS software) are used to train the neural network. The effect of source power, substrate and mold compound thermal co...

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Bibliographic Details
Main Authors: C.H. Leong, I.A. Azid, K.N. Seetharamu
Format: Article
Language:English
Published: Universitas Gadjah Mada 2017-12-01
Series:ASEAN Journal on Science and Technology for Development
Online Access:http://www.ajstd.org/index.php/ajstd/article/view/327

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