THERMAL PERFORMANCE PREDICTION OF PLASTICS BALL GRID ARRAY (PBGA) USING ARTIFICIAL NEURAL NETWORK
Artificial Neural Network (ANN) based on feed-forward backpropagation model is used to predict junction temperature in PBG A package. The limited results obtained from FEM (using IDEAS software) are used to train the neural network. The effect of source power, substrate and mold compound thermal co...
Main Authors: | C.H. Leong, I.A. Azid, K.N. Seetharamu |
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Format: | Article |
Language: | English |
Published: |
Universitas Gadjah Mada
2017-12-01
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Series: | ASEAN Journal on Science and Technology for Development |
Online Access: | http://www.ajstd.org/index.php/ajstd/article/view/327 |
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