A novel method for the fabrication of a high-density carbon nanotube microelectrode array
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using ele...
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doaj-82f7355326344763aa71988cb7dca39c2020-11-24T23:16:17ZengElsevierSensing and Bio-Sensing Research2214-18042015-09-01517A novel method for the fabrication of a high-density carbon nanotube microelectrode arrayAdam Khalifa0Zhaoli Gao1Amine Bermak2Yi Wang3Leanne Lai Hang Chan4Department of Electrical and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong, China; Corresponding author. Tel.: +1 443 825 2009.Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong, ChinaDepartment of Electrical and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong, ChinaDepartment of Electronic Engineering, City University of Hong Kong, Hong Kong, ChinaDepartment of Electronic Engineering, City University of Hong Kong, Hong Kong, ChinaWe present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources. Keywords: Microelectrode array, Neural implant, Carbon nanotubes, Through-silicon via interconnects, Microfabricationhttp://www.sciencedirect.com/science/article/pii/S2214180415000136 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Adam Khalifa Zhaoli Gao Amine Bermak Yi Wang Leanne Lai Hang Chan |
spellingShingle |
Adam Khalifa Zhaoli Gao Amine Bermak Yi Wang Leanne Lai Hang Chan A novel method for the fabrication of a high-density carbon nanotube microelectrode array Sensing and Bio-Sensing Research |
author_facet |
Adam Khalifa Zhaoli Gao Amine Bermak Yi Wang Leanne Lai Hang Chan |
author_sort |
Adam Khalifa |
title |
A novel method for the fabrication of a high-density carbon nanotube microelectrode array |
title_short |
A novel method for the fabrication of a high-density carbon nanotube microelectrode array |
title_full |
A novel method for the fabrication of a high-density carbon nanotube microelectrode array |
title_fullStr |
A novel method for the fabrication of a high-density carbon nanotube microelectrode array |
title_full_unstemmed |
A novel method for the fabrication of a high-density carbon nanotube microelectrode array |
title_sort |
novel method for the fabrication of a high-density carbon nanotube microelectrode array |
publisher |
Elsevier |
series |
Sensing and Bio-Sensing Research |
issn |
2214-1804 |
publishDate |
2015-09-01 |
description |
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources. Keywords: Microelectrode array, Neural implant, Carbon nanotubes, Through-silicon via interconnects, Microfabrication |
url |
http://www.sciencedirect.com/science/article/pii/S2214180415000136 |
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