A novel method for the fabrication of a high-density carbon nanotube microelectrode array

We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using ele...

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Main Authors: Adam Khalifa, Zhaoli Gao, Amine Bermak, Yi Wang, Leanne Lai Hang Chan
Format: Article
Language:English
Published: Elsevier 2015-09-01
Series:Sensing and Bio-Sensing Research
Online Access:http://www.sciencedirect.com/science/article/pii/S2214180415000136
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spelling doaj-82f7355326344763aa71988cb7dca39c2020-11-24T23:16:17ZengElsevierSensing and Bio-Sensing Research2214-18042015-09-01517A novel method for the fabrication of a high-density carbon nanotube microelectrode arrayAdam Khalifa0Zhaoli Gao1Amine Bermak2Yi Wang3Leanne Lai Hang Chan4Department of Electrical and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong, China; Corresponding author. Tel.: +1 443 825 2009.Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong, ChinaDepartment of Electrical and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong, ChinaDepartment of Electronic Engineering, City University of Hong Kong, Hong Kong, ChinaDepartment of Electronic Engineering, City University of Hong Kong, Hong Kong, ChinaWe present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources. Keywords: Microelectrode array, Neural implant, Carbon nanotubes, Through-silicon via interconnects, Microfabricationhttp://www.sciencedirect.com/science/article/pii/S2214180415000136
collection DOAJ
language English
format Article
sources DOAJ
author Adam Khalifa
Zhaoli Gao
Amine Bermak
Yi Wang
Leanne Lai Hang Chan
spellingShingle Adam Khalifa
Zhaoli Gao
Amine Bermak
Yi Wang
Leanne Lai Hang Chan
A novel method for the fabrication of a high-density carbon nanotube microelectrode array
Sensing and Bio-Sensing Research
author_facet Adam Khalifa
Zhaoli Gao
Amine Bermak
Yi Wang
Leanne Lai Hang Chan
author_sort Adam Khalifa
title A novel method for the fabrication of a high-density carbon nanotube microelectrode array
title_short A novel method for the fabrication of a high-density carbon nanotube microelectrode array
title_full A novel method for the fabrication of a high-density carbon nanotube microelectrode array
title_fullStr A novel method for the fabrication of a high-density carbon nanotube microelectrode array
title_full_unstemmed A novel method for the fabrication of a high-density carbon nanotube microelectrode array
title_sort novel method for the fabrication of a high-density carbon nanotube microelectrode array
publisher Elsevier
series Sensing and Bio-Sensing Research
issn 2214-1804
publishDate 2015-09-01
description We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources. Keywords: Microelectrode array, Neural implant, Carbon nanotubes, Through-silicon via interconnects, Microfabrication
url http://www.sciencedirect.com/science/article/pii/S2214180415000136
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