Use of LHP for cooling power electronic components

• Main Authors: Kolková Z., Nemec P., Malcho M., Smitka M.
• Format: Article
• Language: English
• Published: EDP Sciences 2013-04-01
• Series: EPJ Web of Conferences
• Online Access: http://dx.doi.org/10.1051/epjconf/20134501046

The paper deals with use of cooling equipment build on basis two phase thermosyphon loop. This device belongs to a group of loop heat pipe (LHP). This LHP is a two-phase device with extremely high effective thermal conductivity that utilizes the thermodynamic pressure difference to circulate fluid. It was invented in Russia in the early 1980´s. Thermosyphon loop is similar as LHP but it doesn’t contain wick and circulation of the fluid using gravitation force instead of capillary pressure as it is in LHP. The work deals with the cooling insulated gate bipolar transistor with 370 W. The paper describes the course of the heat dissipation using ribbed cooler for natural convection and using fin for forced convection. The results are compared with heat dissipation through thermosyphon loop.