Directional Solidification of Sn-Cu6Sn5 In Situ Composites
The Sn-Cu system presents an important interest from academic and technological point of view because it is part of the family of alloys proposed as lead-free solder alloys for electronic components and also due to the mechanisms involved during the growth of the different phases. Sn-Cu system has t...
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| Format: | Article |
| Language: | English |
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Hindawi Limited
2019-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2019/9210713 |