Design of a Rectangular Pickup Coil Fabricated on a PCB Using WBG Power Semiconductor in Discrete Package

• Main Author: Ui-Jin Kim
• Format: Article
• Language: English
• Published: MDPI AG 2021-03-01
• Series: Applied Sciences
• Subjects: gallium nitride (GaN); Rogowski coil; pickup coil; parameter; inductance; coupling capacitance
• Online Access: https://www.mdpi.com/2076-3417/11/5/2290

Power semiconductors based on wide bandgap (WBG) devices are capable of fast switching and have low on-resistance. Accordingly, a fast sensor with a higher bandwidth is required for circuit inspection based on switch current measurements. Thus, it is necessary to have a current sensor in the printed circuit board (PCB) circuit for diagnosis and protection of the surface mount device (SMD) type circuit system. Accordingly, a pickup coil with the advantages of a high degree of sensor configuration freedom, wide bandwidth, and low cost can be a good alternative. This study analyzes the influence of coil shape and parameters on sensor design as a guideline for embedding a pickup coil in an SMD-type PCB circuit of a WBG power semiconductor-based, half-bridge structure. The mutual inductance and self-inductance values of the coil are considered large variables in the design of a sensor coil for simultaneously maintaining high bandwidth and sensor sensitivity. Therefore, magnetic and frequency response analyses were conducted to verify the correlation with inductance, the influence of coupling capacitance, and the influence of the magnetic field formation via the current flowing through the external trace inside the PCB. The coil model is verified and discussed through simulation and double pulse tests.