Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow

In this paper, a general numerical methodology is developed and validated for the simulation of steady as well as transient thermal and electrical behaviors of thermoelectric generator (TEG)-based air flow self-cooling systems. The present model provides a comprehensive framework to advance the stud...

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Main Authors: Cheng-Xian Lin, Robel Kiflemariam
Format: Article
Language:English
Published: MDPI AG 2019-10-01
Series:Energies
Subjects:
Online Access:https://www.mdpi.com/1996-1073/12/21/4052
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spelling doaj-7f7d2aa0177a455ba4a4c9e05708ea132020-11-25T01:34:55ZengMDPI AGEnergies1996-10732019-10-011221405210.3390/en12214052en12214052Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with AirflowCheng-Xian Lin0Robel Kiflemariam1Department of Mechanical and Materials Engineering, Florida International University, Miami, FL 33174, USADepartment of Mechanical and Materials Engineering, Florida International University, Miami, FL 33174, USAIn this paper, a general numerical methodology is developed and validated for the simulation of steady as well as transient thermal and electrical behaviors of thermoelectric generator (TEG)-based air flow self-cooling systems. The present model provides a comprehensive framework to advance the study of self-cooling applications by combining fluid flow, heat transfer and electric circuit simulations. The methodology is implemented by equation-based coupled modeling capabilities from multidisciplinary fields to capture the dynamic thermos-electric interaction in TEG elements, enabling the simulation of overall heating/cooling/power characteristics as well as spatially distributed thermal and flow fields in the entire device. Experiments have been conducted on two types of self-cooling arrangements to measure the device temperature, voltage and power produced by TEG modules. It was found that the computational model was able to predict the experimental results within 5% error. A parametric study was carried out using the validated model to study the effect of heat sink geometry and TEG arrangements on device temperature and power produced by the device. It was found that the power for self-cooling could be maximized by proper matching of the TEG modules to the fluid mover. Although an increase in fin density results in a rise in fan power consumption, a marked increase in net power and decreases in thermal resistance are observed.https://www.mdpi.com/1996-1073/12/21/4052thermoelectric generatornumerical simulationself-coolingelectronic cooling
collection DOAJ
language English
format Article
sources DOAJ
author Cheng-Xian Lin
Robel Kiflemariam
spellingShingle Cheng-Xian Lin
Robel Kiflemariam
Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow
Energies
thermoelectric generator
numerical simulation
self-cooling
electronic cooling
author_facet Cheng-Xian Lin
Robel Kiflemariam
author_sort Cheng-Xian Lin
title Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow
title_short Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow
title_full Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow
title_fullStr Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow
title_full_unstemmed Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow
title_sort numerical simulation and validation of thermoeletric generator based self-cooling system with airflow
publisher MDPI AG
series Energies
issn 1996-1073
publishDate 2019-10-01
description In this paper, a general numerical methodology is developed and validated for the simulation of steady as well as transient thermal and electrical behaviors of thermoelectric generator (TEG)-based air flow self-cooling systems. The present model provides a comprehensive framework to advance the study of self-cooling applications by combining fluid flow, heat transfer and electric circuit simulations. The methodology is implemented by equation-based coupled modeling capabilities from multidisciplinary fields to capture the dynamic thermos-electric interaction in TEG elements, enabling the simulation of overall heating/cooling/power characteristics as well as spatially distributed thermal and flow fields in the entire device. Experiments have been conducted on two types of self-cooling arrangements to measure the device temperature, voltage and power produced by TEG modules. It was found that the computational model was able to predict the experimental results within 5% error. A parametric study was carried out using the validated model to study the effect of heat sink geometry and TEG arrangements on device temperature and power produced by the device. It was found that the power for self-cooling could be maximized by proper matching of the TEG modules to the fluid mover. Although an increase in fin density results in a rise in fan power consumption, a marked increase in net power and decreases in thermal resistance are observed.
topic thermoelectric generator
numerical simulation
self-cooling
electronic cooling
url https://www.mdpi.com/1996-1073/12/21/4052
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