Detection and Characterization Method for Interface Bonding Defects of New Composite Materials
The defects such as voids and debonding within the bonding interface between the composite and the substrate are the key factors affecting the safe use of materials. In this study, Industrial Computed Tomography (ICT) was used to perform non-destructive tests of bonding defects. High-precision chara...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2019-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8813064/ |