Detection and Characterization Method for Interface Bonding Defects of New Composite Materials

• Main Authors: Yintang Wen, Song Zhang, Yuyan Zhang
• Format: Article
• Language: English
• Published: IEEE 2019-01-01
• Series: IEEE Access
• Subjects: Interface bonding defects; voids and debonding; industrial computed tomography (ICT); segmentation method; detection and characterization
• Online Access: https://ieeexplore.ieee.org/document/8813064/

The defects such as voids and debonding within the bonding interface between the composite and the substrate are the key factors affecting the safe use of materials. In this study, Industrial Computed Tomography (ICT) was used to perform non-destructive tests of bonding defects. High-precision characterization methods are required to quantify the defects. This paper proposes an improved image segmentation processing method for accurate extraction of defect edges and quantitative characterization. With the proposed method combining mathematical morphology and Fuzzy C-Means (FCM) threshold segmentation, the irregular defects of voids and debonding can be visualized and established with corresponding quantitative indicators. The experimental results show that the defect area error of the tested bonding layer is within ±6%, which satisfies the requirements of accurate detection and characterization of interface bonding layer defects of composite components. This work provides a strong technical basis for the reliability assessment of new ceramic matrix composites (CMCs) bonded structural members.