Towards Digital Manufacturing of Smart Multimaterial Fibers

Abstract Fibers are ubiquitous and usually passive. Optoelectronics realized in a fiber could revolutionize multiple application areas, including biosynthetic and wearable electronics, environmental sensing, and energy harvesting. However, the realization of high-performance electronics in a fiber r...

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Main Authors: Camila Faccini de Lima, Louis A. van der Elst, Veda Narayana Koraganji, Mengxin Zheng, Merve Gokce Kurtoglu, Alexander Gumennik
Format: Article
Language:English
Published: SpringerOpen 2019-06-01
Series:Nanoscale Research Letters
Subjects:
Online Access:http://link.springer.com/article/10.1186/s11671-019-3031-x
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spelling doaj-7d8433e08ca54919aa4e59d7a9f495aa2020-11-25T03:11:48ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2019-06-0114111610.1186/s11671-019-3031-xTowards Digital Manufacturing of Smart Multimaterial FibersCamila Faccini de Lima0Louis A. van der Elst1Veda Narayana Koraganji2Mengxin Zheng3Merve Gokce Kurtoglu4Alexander Gumennik5Department of Intelligent Systems Engineering, School of Informatics, Computing and Engineering, Indiana UniversityDepartment of Intelligent Systems Engineering, School of Informatics, Computing and Engineering, Indiana UniversityDepartment of Intelligent Systems Engineering, School of Informatics, Computing and Engineering, Indiana UniversityDepartment of Intelligent Systems Engineering, School of Informatics, Computing and Engineering, Indiana UniversityDepartment of Intelligent Systems Engineering, School of Informatics, Computing and Engineering, Indiana UniversityDepartment of Intelligent Systems Engineering, School of Informatics, Computing and Engineering, Indiana UniversityAbstract Fibers are ubiquitous and usually passive. Optoelectronics realized in a fiber could revolutionize multiple application areas, including biosynthetic and wearable electronics, environmental sensing, and energy harvesting. However, the realization of high-performance electronics in a fiber remains a demanding challenge due to the elusiveness of a material processing strategy that would allow the wrapping of devices made in crystalline semiconductors, such as silicon, into a fiber in an ordered, addressable, and scalable manner. Current fiber-sensor fabrication approaches either are non-scalable or limit the choice of semiconductors to the amorphous ones, such as chalcogenide glasses, inferior to silicon in their electronic performance, resulting in limited bandwidth and sensitivity of such sensors when compared to a standard silicon photodiode. Our group substantiates a universal in-fiber manufacturing of logic circuits and sensory systems analogous to very large-scale integration (VLSI), which enabled the emergence of the modern microprocessor. We develop a versatile hybrid-fabrication methodology that assembles in-fiber material architectures typical to integrated microelectronic devices and systems in silica, silicon, and high-temperature metals. This methodology, dubbed “VLSI for Fibers,” or “VLSI-Fi,” combines 3D printing of preforms, a thermal draw of fibers, and post-draw assembly of fiber-embedded integrated devices by means of material-selective spatially coherent capillary breakup of the fiber cores. We believe that this method will deliver a new class of durable, low cost, pervasive fiber devices, and sensors, enabling integration of fabrics met with human-made objects, such as furniture and apparel, into the Internet of Things (IoT). Furthermore, it will boost innovation in 3D printing, extending the digital manufacturing approach into the nanoelectronics realm.http://link.springer.com/article/10.1186/s11671-019-3031-xVLSIFiber devicesMultimaterial fibersMicrostructures3D printing of glassFluid dynamics
collection DOAJ
language English
format Article
sources DOAJ
author Camila Faccini de Lima
Louis A. van der Elst
Veda Narayana Koraganji
Mengxin Zheng
Merve Gokce Kurtoglu
Alexander Gumennik
spellingShingle Camila Faccini de Lima
Louis A. van der Elst
Veda Narayana Koraganji
Mengxin Zheng
Merve Gokce Kurtoglu
Alexander Gumennik
Towards Digital Manufacturing of Smart Multimaterial Fibers
Nanoscale Research Letters
VLSI
Fiber devices
Multimaterial fibers
Microstructures
3D printing of glass
Fluid dynamics
author_facet Camila Faccini de Lima
Louis A. van der Elst
Veda Narayana Koraganji
Mengxin Zheng
Merve Gokce Kurtoglu
Alexander Gumennik
author_sort Camila Faccini de Lima
title Towards Digital Manufacturing of Smart Multimaterial Fibers
title_short Towards Digital Manufacturing of Smart Multimaterial Fibers
title_full Towards Digital Manufacturing of Smart Multimaterial Fibers
title_fullStr Towards Digital Manufacturing of Smart Multimaterial Fibers
title_full_unstemmed Towards Digital Manufacturing of Smart Multimaterial Fibers
title_sort towards digital manufacturing of smart multimaterial fibers
publisher SpringerOpen
series Nanoscale Research Letters
issn 1931-7573
1556-276X
publishDate 2019-06-01
description Abstract Fibers are ubiquitous and usually passive. Optoelectronics realized in a fiber could revolutionize multiple application areas, including biosynthetic and wearable electronics, environmental sensing, and energy harvesting. However, the realization of high-performance electronics in a fiber remains a demanding challenge due to the elusiveness of a material processing strategy that would allow the wrapping of devices made in crystalline semiconductors, such as silicon, into a fiber in an ordered, addressable, and scalable manner. Current fiber-sensor fabrication approaches either are non-scalable or limit the choice of semiconductors to the amorphous ones, such as chalcogenide glasses, inferior to silicon in their electronic performance, resulting in limited bandwidth and sensitivity of such sensors when compared to a standard silicon photodiode. Our group substantiates a universal in-fiber manufacturing of logic circuits and sensory systems analogous to very large-scale integration (VLSI), which enabled the emergence of the modern microprocessor. We develop a versatile hybrid-fabrication methodology that assembles in-fiber material architectures typical to integrated microelectronic devices and systems in silica, silicon, and high-temperature metals. This methodology, dubbed “VLSI for Fibers,” or “VLSI-Fi,” combines 3D printing of preforms, a thermal draw of fibers, and post-draw assembly of fiber-embedded integrated devices by means of material-selective spatially coherent capillary breakup of the fiber cores. We believe that this method will deliver a new class of durable, low cost, pervasive fiber devices, and sensors, enabling integration of fabrics met with human-made objects, such as furniture and apparel, into the Internet of Things (IoT). Furthermore, it will boost innovation in 3D printing, extending the digital manufacturing approach into the nanoelectronics realm.
topic VLSI
Fiber devices
Multimaterial fibers
Microstructures
3D printing of glass
Fluid dynamics
url http://link.springer.com/article/10.1186/s11671-019-3031-x
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