Highly elastic conductive polymeric MEMS

Polymeric structures with integrated, functional microelectrical mechanical systems (MEMS) elements are increasingly important in various applications such as biomedical systems or wearable smart devices. These applications require highly flexible and elastic polymers with good conductivity, which c...

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Main Authors: J Ruhhammer, M Zens, F Goldschmidtboeing, A Seifert, P Woias
Format: Article
Language:English
Published: Taylor & Francis Group 2015-02-01
Series:Science and Technology of Advanced Materials
Subjects:
Online Access:http://dx.doi.org/10.1088/1468-6996/16/1/015003
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spelling doaj-7cca55eea16446e8b2551d4e7db310f82020-11-25T03:20:46ZengTaylor & Francis GroupScience and Technology of Advanced Materials1468-69961878-55142015-02-0116110.1088/1468-6996/16/1/01500311661248Highly elastic conductive polymeric MEMSJ Ruhhammer0M Zens1F Goldschmidtboeing2A Seifert3P Woias4University of FreiburgUniversity of FreiburgUniversity of FreiburgUniversity of FreiburgUniversity of FreiburgPolymeric structures with integrated, functional microelectrical mechanical systems (MEMS) elements are increasingly important in various applications such as biomedical systems or wearable smart devices. These applications require highly flexible and elastic polymers with good conductivity, which can be embedded into a matrix that undergoes large deformations. Conductive polydimethylsiloxane (PDMS) is a suitable candidate but is still challenging to fabricate. Conductivity is achieved by filling a nonconductive PDMS matrix with conductive particles. In this work, we present an approach that uses new mixing techniques to fabricate conductive PDMS with different fillers such as carbon black, silver particles, and multiwalled carbon nanotubes. Additionally, the electrical properties of all three composites are examined under continuous mechanical stress. Furthermore, we present a novel, low-cost, simple three-step molding process that transfers a micro patterned silicon master into a polystyrene (PS) polytetrafluoroethylene (PTFE) replica with improved release features. This PS/PTFE mold is used for subsequent structuring of conductive PDMS with high accuracy. The non sticking characteristics enable the fabrication of delicate structures using a very soft PDMS, which is usually hard to release from conventional molds. Moreover, the process can also be applied to polyurethanes and various other material combinations.http://dx.doi.org/10.1088/1468-6996/16/1/015003benchtop micromoldingconductive pdmspolymeric memscapacitive strain gaugehighly elasticantisticking
collection DOAJ
language English
format Article
sources DOAJ
author J Ruhhammer
M Zens
F Goldschmidtboeing
A Seifert
P Woias
spellingShingle J Ruhhammer
M Zens
F Goldschmidtboeing
A Seifert
P Woias
Highly elastic conductive polymeric MEMS
Science and Technology of Advanced Materials
benchtop micromolding
conductive pdms
polymeric mems
capacitive strain gauge
highly elastic
antisticking
author_facet J Ruhhammer
M Zens
F Goldschmidtboeing
A Seifert
P Woias
author_sort J Ruhhammer
title Highly elastic conductive polymeric MEMS
title_short Highly elastic conductive polymeric MEMS
title_full Highly elastic conductive polymeric MEMS
title_fullStr Highly elastic conductive polymeric MEMS
title_full_unstemmed Highly elastic conductive polymeric MEMS
title_sort highly elastic conductive polymeric mems
publisher Taylor & Francis Group
series Science and Technology of Advanced Materials
issn 1468-6996
1878-5514
publishDate 2015-02-01
description Polymeric structures with integrated, functional microelectrical mechanical systems (MEMS) elements are increasingly important in various applications such as biomedical systems or wearable smart devices. These applications require highly flexible and elastic polymers with good conductivity, which can be embedded into a matrix that undergoes large deformations. Conductive polydimethylsiloxane (PDMS) is a suitable candidate but is still challenging to fabricate. Conductivity is achieved by filling a nonconductive PDMS matrix with conductive particles. In this work, we present an approach that uses new mixing techniques to fabricate conductive PDMS with different fillers such as carbon black, silver particles, and multiwalled carbon nanotubes. Additionally, the electrical properties of all three composites are examined under continuous mechanical stress. Furthermore, we present a novel, low-cost, simple three-step molding process that transfers a micro patterned silicon master into a polystyrene (PS) polytetrafluoroethylene (PTFE) replica with improved release features. This PS/PTFE mold is used for subsequent structuring of conductive PDMS with high accuracy. The non sticking characteristics enable the fabrication of delicate structures using a very soft PDMS, which is usually hard to release from conventional molds. Moreover, the process can also be applied to polyurethanes and various other material combinations.
topic benchtop micromolding
conductive pdms
polymeric mems
capacitive strain gauge
highly elastic
antisticking
url http://dx.doi.org/10.1088/1468-6996/16/1/015003
work_keys_str_mv AT jruhhammer highlyelasticconductivepolymericmems
AT mzens highlyelasticconductivepolymericmems
AT fgoldschmidtboeing highlyelasticconductivepolymericmems
AT aseifert highlyelasticconductivepolymericmems
AT pwoias highlyelasticconductivepolymericmems
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