Effect of ultrasonic elliptical vibration assistance on the surface layer defect of M-plane sapphire in microcutting

Surface-layer defects of M-plane sapphire caused by ultrasonic vibration-assisted cutting were investigated in this paper through comparison cutting experiments. Topography analysis results indicate that when the cutting direction is not along a-axis or c-axis, the spalling defects of conventional c...

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Bibliographic Details
Main Authors: Yinhui Wang, Zhiqiang Liang, Wenxiang Zhao, Xibin Wang, Hao Wang
Format: Article
Language:English
Published: Elsevier 2020-07-01
Series:Materials & Design
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127520302896