Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe2O4 Particles

Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe2O4 Particles

A Pd-free activation pretreatment process was developed for electroless Ni-P plating on NiFe2O4 particles. The main influencing factors, including NiCl2·6H2O concentration, pH of electroless bath and temperature, were investigated. Microstructures of the coating layers were characterized...

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Bibliographic Details
Main Authors: Junfei Ma, Zhigang Zhang, Yihan Liu, Xiao Zhang, Hongjie Luo, Guangchun Yao
Format: Article
Language:English
Published: MDPI AG 2018-09-01
Series:Materials
Subjects:
electroless plating
NiFe2O4
activation
microstructure
Online Access:http://www.mdpi.com/1996-1944/11/10/1810

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