Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact

Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact

In continuation and development of our previous works where nuclear reactions of moderate energy (10 – 400 MeV) protons with Si, Al and W have been investigated, the results of reactions with Cu are reported in this paper. Cu is a most important component in composition of materials in contact pads...

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Main Authors: Chechenin N. G., Chuvilskaya T. V., Shirokova A. A.
Format: Article
Language:English
Published: EDP Sciences 2016-01-01
Series:EPJ Web of Conferences
Online Access:http://dx.doi.org/10.1051/epjconf/201611705006
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spelling doaj-7ab034f137194f72882517eec51aa0ee2021-08-02T10:28:46ZengEDP SciencesEPJ Web of Conferences2100-014X2016-01-011170500610.1051/epjconf/201611705006epjconf_nn2016_05006Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impactChechenin N. G.Chuvilskaya T. V.Shirokova A. A.In continuation and development of our previous works where nuclear reactions of moderate energy (10 – 400 MeV) protons with Si, Al and W have been investigated, the results of reactions with Cu are reported in this paper. Cu is a most important component in composition of materials in contact pads and pathways of modern and perspective ultra large-scale integration circuitry, especially in 3D topology.http://dx.doi.org/10.1051/epjconf/201611705006
collection DOAJ
language English
format Article
sources DOAJ
author Chechenin N. G.
Chuvilskaya T. V.
Shirokova A. A.
spellingShingle Chechenin N. G.
Chuvilskaya T. V.
Shirokova A. A.
Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
EPJ Web of Conferences
author_facet Chechenin N. G.
Chuvilskaya T. V.
Shirokova A. A.
author_sort Chechenin N. G.
title Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
title_short Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
title_full Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
title_fullStr Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
title_full_unstemmed Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
title_sort nuclear contribution into single-event upset in 3d on-board electronics at moderate energy cosmic proton impact
publisher EDP Sciences
series EPJ Web of Conferences
issn 2100-014X
publishDate 2016-01-01
description In continuation and development of our previous works where nuclear reactions of moderate energy (10 – 400 MeV) protons with Si, Al and W have been investigated, the results of reactions with Cu are reported in this paper. Cu is a most important component in composition of materials in contact pads and pathways of modern and perspective ultra large-scale integration circuitry, especially in 3D topology.
url http://dx.doi.org/10.1051/epjconf/201611705006
work_keys_str_mv AT checheninng nuclearcontributionintosingleeventupsetin3donboardelectronicsatmoderateenergycosmicprotonimpact
AT chuvilskayatv nuclearcontributionintosingleeventupsetin3donboardelectronicsatmoderateenergycosmicprotonimpact
AT shirokovaaa nuclearcontributionintosingleeventupsetin3donboardelectronicsatmoderateenergycosmicprotonimpact
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