Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact
In continuation and development of our previous works where nuclear reactions of moderate energy (10 – 400 MeV) protons with Si, Al and W have been investigated, the results of reactions with Cu are reported in this paper. Cu is a most important component in composition of materials in contact pads...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2016-01-01
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| Series: | EPJ Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/epjconf/201611705006 |
| Summary: | In continuation and development of our previous works where nuclear reactions of moderate energy (10 – 400 MeV) protons with Si, Al and W have been investigated, the results of reactions with Cu are reported in this paper. Cu is a most important component in composition of materials in contact pads and pathways of modern and perspective ultra large-scale integration circuitry, especially in 3D topology. |
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| ISSN: | 2100-014X |