Advances in flexible and soft electronics

Bibliographic Details
Main Authors: Thierry Djenizian, Benjamin C. K. Tee, Marc Ramuz, Lei Fang
Format: Article
Language:English
Published: AIP Publishing LLC 2019-03-01
Series:APL Materials
Online Access:http://dx.doi.org/10.1063/1.5095596
id doaj-7a8ec6d5e93e4623a850e5e51ae25e04
record_format Article
spelling doaj-7a8ec6d5e93e4623a850e5e51ae25e042020-11-25T01:08:41ZengAIP Publishing LLCAPL Materials2166-532X2019-03-0173031201031201-110.1063/1.5095596014991APMAdvances in flexible and soft electronicsThierry Djenizian0Benjamin C. K. Tee1Marc Ramuz2Lei Fang3Ecole des Mines de Saint-Etinne, Saint-Etienne, Rhone-Alpes 42023, FranceNational University of Singapore, Singapore 119260, SingaporeEcole des Mines de Saint-Etinne, Saint-Etienne, Rhone-Alpes 42023, FranceArtie Mcferrin Department of Chemical Engineering, Texas A&M University, College Station, Texas 77843, USAhttp://dx.doi.org/10.1063/1.5095596
collection DOAJ
language English
format Article
sources DOAJ
author Thierry Djenizian
Benjamin C. K. Tee
Marc Ramuz
Lei Fang
spellingShingle Thierry Djenizian
Benjamin C. K. Tee
Marc Ramuz
Lei Fang
Advances in flexible and soft electronics
APL Materials
author_facet Thierry Djenizian
Benjamin C. K. Tee
Marc Ramuz
Lei Fang
author_sort Thierry Djenizian
title Advances in flexible and soft electronics
title_short Advances in flexible and soft electronics
title_full Advances in flexible and soft electronics
title_fullStr Advances in flexible and soft electronics
title_full_unstemmed Advances in flexible and soft electronics
title_sort advances in flexible and soft electronics
publisher AIP Publishing LLC
series APL Materials
issn 2166-532X
publishDate 2019-03-01
url http://dx.doi.org/10.1063/1.5095596
work_keys_str_mv AT thierrydjenizian advancesinflexibleandsoftelectronics
AT benjamincktee advancesinflexibleandsoftelectronics
AT marcramuz advancesinflexibleandsoftelectronics
AT leifang advancesinflexibleandsoftelectronics
_version_ 1725182019541925888