Constructing robust superhydrophobic interface with self-assembled Cu<sub>6</sub>Sn<sub>5</sub> arrays and application in copper corrosion inhibition

Constructing robust superhydrophobic interface with self-assembled Cu<sub>6</sub>Sn<sub>5</sub> arrays and application in copper corrosion inhibition

The superhydrophobic scallop-like Cu<sub>6</sub>Sn<sub>5</sub> micro/nano structure were successfully constructed on pure copper substrate by heat-induced Cu/Sn interfacial metallurgical reaction and simple chemical modification process. The microstructure, chemical compositi...

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Bibliographic Details
Main Authors: GAO Zhao-qing, WANG Chen, CHEN Yin-bo, SHANG Sheng-yan, CHEN Fei, MA Hai-tao, WANG Yun-peng
Format: Article
Language:zho
Published: Journal of Materials Engineering 2021-08-01
Series:Journal of Materials Engineering
Subjects:
self-assembling
scallop-like cu<sub>6</sub>sn<sub>5</sub>
metallurgical bonding
superhydrophobicity
corrosion resistance
Online Access:http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2020.001007

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