Constructing robust superhydrophobic interface with self-assembled Cu₆Sn₅ arrays and application in copper corrosion inhibition

• Main Authors: GAO Zhao-qing, WANG Chen, CHEN Yin-bo, SHANG Sheng-yan, CHEN Fei, MA Hai-tao, WANG Yun-peng
• Format: Article
• Language: zho
• Published: Journal of Materials Engineering 2021-08-01
• Series: Journal of Materials Engineering
• Subjects: self-assembling; scallop-like cu₆sn₅; metallurgical bonding; superhydrophobicity; corrosion resistance
• Online Access: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2020.001007

The superhydrophobic scallop-like Cu₆Sn₅ micro/nano structure were successfully constructed on pure copper substrate by heat-induced Cu/Sn interfacial metallurgical reaction and simple chemical modification process. The microstructure, chemical composition and corrosion resistance of as-prepared samples were characterized by field emission scanning electron microscopy and X-ray photoelectron spectroscopy, <i>etc</i>. The results show that the averaged shear resistance strength between micro Cu₆Sn₅ and Cu substrate is higher than 40 MPa. After modified with myristic acid and Cu²⁺, copper myristate with low surface energy is formed on the armor Cu₆Sn₅ surface. The wetting angle of water droplets on as-modified surface is higher than 150° and its rolling angle is 7.2°. Compared with pure copper, the self corrosion current density of the samples modified by copper myristate in 3.5%NaCl(mass fraction) solution is about 1/10 of that of the samples before modification,showing better corrosion resistance. Based on the metallurgical bonding mechanism between intermetallic compounds and metal matrix, the armor formation strategy of metal materials in micro-scale by heat-induced interfacial reaction is proposed, which can successfully solve the open and key scientific problem of low mechanical stability for artificial superhydrophobic interface.