Pore Narrowing of Mesoporous Silica Materials

To use mesoporous silicas as low-k materials, the pore entrances must be really small to avoid diffusion of metals that can increase the dielectric constant of the low-k dielectric. In this paper we present a new method to narrow the pores of mesoporous materials through grafting of a cyclic-bridged...

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Main Authors: Christophe Detavernier, Pascal Van Der Voort, Isabel Van Driessche, Mikhail R. Baklanov, Els De Canck, Elisabeth Levrau, Frederik Goethals
Format: Article
Language:English
Published: MDPI AG 2013-02-01
Series:Materials
Subjects:
Online Access:http://www.mdpi.com/1996-1944/6/2/570
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spelling doaj-7988afc98ae2496fa6ba7bcb85ef949a2020-11-24T22:40:06ZengMDPI AGMaterials1996-19442013-02-016257057910.3390/ma6020570Pore Narrowing of Mesoporous Silica MaterialsChristophe DetavernierPascal Van Der VoortIsabel Van DriesscheMikhail R. BaklanovEls De CanckElisabeth LevrauFrederik GoethalsTo use mesoporous silicas as low-k materials, the pore entrances must be really small to avoid diffusion of metals that can increase the dielectric constant of the low-k dielectric. In this paper we present a new method to narrow the pores of mesoporous materials through grafting of a cyclic-bridged organosilane precursor. As mesoporous material, the well-studied MCM-41 powder was selected to allow an easy characterization of the grafting reactions. Firstly, the successful grafting of the cyclic-bridged organosilane precursor on MCM-41 is presented. Secondly, it is demonstrated that pore narrowing can be obtained without losing porosity by removing the porogen template after grafting. The remaining silanols in the pores can then be end-capped with hexamethyl disilazane (HMDS) to make the material completely hydrophobic. Finally, we applied the pore narrowing method on organosilica films to prove that this method is also successful on existing low-k materials.http://www.mdpi.com/1996-1944/6/2/570pore sealingMCM-41bridged organosilanes
collection DOAJ
language English
format Article
sources DOAJ
author Christophe Detavernier
Pascal Van Der Voort
Isabel Van Driessche
Mikhail R. Baklanov
Els De Canck
Elisabeth Levrau
Frederik Goethals
spellingShingle Christophe Detavernier
Pascal Van Der Voort
Isabel Van Driessche
Mikhail R. Baklanov
Els De Canck
Elisabeth Levrau
Frederik Goethals
Pore Narrowing of Mesoporous Silica Materials
Materials
pore sealing
MCM-41
bridged organosilanes
author_facet Christophe Detavernier
Pascal Van Der Voort
Isabel Van Driessche
Mikhail R. Baklanov
Els De Canck
Elisabeth Levrau
Frederik Goethals
author_sort Christophe Detavernier
title Pore Narrowing of Mesoporous Silica Materials
title_short Pore Narrowing of Mesoporous Silica Materials
title_full Pore Narrowing of Mesoporous Silica Materials
title_fullStr Pore Narrowing of Mesoporous Silica Materials
title_full_unstemmed Pore Narrowing of Mesoporous Silica Materials
title_sort pore narrowing of mesoporous silica materials
publisher MDPI AG
series Materials
issn 1996-1944
publishDate 2013-02-01
description To use mesoporous silicas as low-k materials, the pore entrances must be really small to avoid diffusion of metals that can increase the dielectric constant of the low-k dielectric. In this paper we present a new method to narrow the pores of mesoporous materials through grafting of a cyclic-bridged organosilane precursor. As mesoporous material, the well-studied MCM-41 powder was selected to allow an easy characterization of the grafting reactions. Firstly, the successful grafting of the cyclic-bridged organosilane precursor on MCM-41 is presented. Secondly, it is demonstrated that pore narrowing can be obtained without losing porosity by removing the porogen template after grafting. The remaining silanols in the pores can then be end-capped with hexamethyl disilazane (HMDS) to make the material completely hydrophobic. Finally, we applied the pore narrowing method on organosilica films to prove that this method is also successful on existing low-k materials.
topic pore sealing
MCM-41
bridged organosilanes
url http://www.mdpi.com/1996-1944/6/2/570
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