Soldering of Electronics Components on 3D-Printed Conductive Substrates

Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical comp...

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Bibliographic Details
Main Authors: Bartłomiej Podsiadły, Andrzej Skalski, Marcin Słoma
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/14/3850