An Alternative Way of Making Bumps for Tape Automated Bonding

An Alternative Way of Making Bumps for Tape Automated Bonding

Bibliographic Details
Main Authors:	Jind&#345;ich Vil&#237;m, Karel Kopejtko
Format:	Article
Language:	English
Published:	Hindawi Limited 1980-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.6.185

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