Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

• Main Authors: Florian Thoma, Frank Goldschmidtböing, Keith Cobry, Peter Woias
• Format: Article
• Language: English
• Published: MDPI AG 2014-09-01
• Series: Micromachines
• Subjects: reflow bonding; Pyrex; fluidic; packaging
• Online Access: http://www.mdpi.com/2072-666X/5/3/783

In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanically actuated membrane micropump which includes passive membranes for fluid metering. To enable proper functioning after full integration, a technique for device assembly must be established which does not introduce additional stress into the system, but fulfills all other requirements, like pressure tolerance and chemical stability. This is achieved with a stress-free thermal bonding principle to bond Pyrex to silicon in a five-layer stack: after alignment, the silicon-Pyrex-silicon stack is heated to 730 °C. Above the glass transition temperature of 525 °C Pyrex exhibits viscoelastic behavior. This allows the glass layer to come into close mechanical contact with the upper and lower silicon layers. The high temperature and the close contact promotes the formation of a stable and reliable Si-O-Si bond, without introducing mechanical stress into the system, and without deformation upon cooling due to thermal mismatch.