Exploring the properties of hemicellulose based carboxymethyl cellulose film as a potential green packaging

• Main Authors: P.R.D. Weerasooriya, R. Nadhilah, F.A.T. Owolabi, R. Hashim, H.P.S. Abdul Khalil, Z.A. Syahariza, M.H. Hussin, Salim Hiziroglu, M.K.M. Haafiz
• Format: Article
• Language: English
• Published: Elsevier 2020-02-01
• Series: Current Research in Green and Sustainable Chemistry
• Subjects: Hemicellulose; Oil palm empty fruit bunch; Carboxymethyl cellulose; Mechanical properties
• Online Access: http://www.sciencedirect.com/science/article/pii/S2666086520300047

The performance of hemicellulose based carboxymethyl cellulose (H-CMC) films was investigated. Hemicellulose was extracted from oil palm empty fruit bunch (OPEFB) through alkali-ethanol extraction technique. Then the obtained hemicellulose was mixed with distilled water and embedded with carboxymethyl cellulose (CMC) at different hemicellulose loadings (20, 40, 60, and 80 wt %). Solution casting method was applied to produce H-CMC films within the thickness range (0.076–0.12 mm). The prepared films were characterized using tensile test, fourier transform infrared spectroscopy (FTIR), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and scanning electron microscopy (SEM). Glass transition temperature (Tg) of H-CMC films has increased with hemicellulose content. According to mechanical properties, optimum performance has given by the film having 60 wt% of hemicellulose. FTIR spectroscopy confirms that the chemical structure of CMC has not been altered by the addition of hemicellulose. TGA and DSC curves represent that the thermal stability of pure CMC has increased with the added hemicellulose content. Surface morphology becomes rough when the hemicellulose loading is increased excessively (80 wt%). As per the overall result, 60 wt% of hemicellulose can be identified as the optimum loading into CMC as a potential material for green packaging applications. Further the research aimed to develop the film structure by incorporating functional materials for future intended applications such as electrically conductive and photocatalytic thin films.