Solder joint reliability based on creep strain energy density for SAC305 and doped SAC solders
Parallel to the development of new lead-free solders, electronic packaging has gone through a considerable evolution. A redistribution of layers allows the increase of functionality by increasing the number of inputs/outputsin the packagewhile reducing the size. The reliability of the package is str...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2021-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://www.matec-conferences.org/articles/matecconf/pdf/2021/12/matecconf_mse21_02005.pdf |