Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting tempera...

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Bibliographic Details
Main Authors: Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung
Format: Article
Language:English
Published: MDPI AG 2021-02-01
Series:Metals
Subjects:
low-temperature solder
Sn-58wt%Bi
melting temperature
microstructure
mechanical property
Online Access:https://www.mdpi.com/2075-4701/11/2/364

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