Effects of Discharge Current and Target Thickness in Dc-Magnetron Sputtering on Grain Size of Copper Deposited Samples

Effects of Discharge Current and Target Thickness in Dc-Magnetron Sputtering on Grain Size of Copper Deposited Samples

A study of the effects of the discharge (sputtering) currents (60-75 mA) and the thickness of copper target (0.037, 0.055 and 0.085 mm) on the prepared samples was performed. These samples were deposited with pure copper on a glass substrate using dc magnetron sputtering with a magnetic flux densit...

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Bibliographic Details
Main Author:	Yahya et al.
Format:	Article
Language:	Arabic
Published:	College of Science for Women, University of Baghdad 2019-03-01
Series:	Baghdad Science Journal
Subjects:	Copper grain size, Dc magnetron sputtering, Sputtering current, Surface roughness
Online Access:	http://bsj.uobaghdad.edu.iq/index.php/BSJ/article/view/3185

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