Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips

• Main Authors: Chaoqun Jiao, Zuoming Zhang, Zhibin Zhao, Xiumin Zhang
• Format: Article
• Language: English
• Published: MDPI AG 2020-07-01
• Series: Sensors
• Subjects: Press-Pack IGBT (PPI); Chip reliability; PCB Rogowski Coil; Current measurement
• Online Access: https://www.mdpi.com/1424-8220/20/15/4080

Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss chips, and the currents of each chip will be uneven in the process of turning on and off, which will affect the reliability of the device. To measure the currents of each chip, based on the analysis of the principle and equivalent model of the Rogowski coil, this paper puts forward the design scheme and design index of multi-layer printed circuit board (PCB) Rogowski coil with good high-frequency performance, strong anti-interference ability and sufficient sensitivity. With the simulation analysis of Altium Designer and ANSYS softwares, a 1 mm thick, 76-turn integrated four-layer PCB Rogowski coil is designed. Then, adding a composite integrator, an integrated Rogowski coil sensor for measurement of PPI chips currents is designed. The Pspice simulation and the experiment results show that the sensor is fully satisfied with the chip current measurement.