Mapping of integrated PIN diodes with a 3D architecture by scanning microwave impedance microscopy and dynamic spectroscopy

This work addresses the need for a comprehensive methodology for nanoscale electrical testing dedicated to the analysis of both “front end of line” (FEOL) (doped semiconducting layers) and “back end of line” (BEOL) layers (metallization, trench dielectric, and isolation) of highly integrated microel...

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Bibliographic Details
Main Authors: Rosine Coq Germanicus, Peter De Wolf, Florent Lallemand, Catherine Bunel, Serge Bardy, Hugues Murray, Ulrike Lüders
Format: Article
Language:English
Published: Beilstein-Institut 2020-11-01
Series:Beilstein Journal of Nanotechnology
Subjects:
Online Access:https://doi.org/10.3762/bjnano.11.159