Remarks on Wire and Die Bonding for Hybrid Circuits

Remarks on Wire and Die Bonding for Hybrid Circuits

Bibliographic Details
Main Author:	A. Soffa
Format:	Article
Language:	English
Published:	Hindawi Limited 1977-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.4.157

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