Remarks on Wire and Die Bonding for Hybrid Circuits

Bibliographic Details
Main Author:	A. Soffa
Format:	Article
Language:	English
Published:	Hindawi Limited 1977-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.4.157

id	doaj-6e06e8e8694d49b6890cfe8137c3c8f9
record_format	Article
spelling	doaj-6e06e8e8694d49b6890cfe8137c3c8f92020-11-24T21:20:06ZengHindawi LimitedActive and Passive Electronic Components0882-75161563-50311977-01-0143-415716110.1155/APEC.4.157Remarks on Wire and Die Bonding for Hybrid CircuitsA. Soffahttp://dx.doi.org/10.1155/APEC.4.157
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	A. Soffa
spellingShingle	A. Soffa Remarks on Wire and Die Bonding for Hybrid Circuits Active and Passive Electronic Components
author_facet	A. Soffa
author_sort	A. Soffa
title	Remarks on Wire and Die Bonding for Hybrid Circuits
title_short	Remarks on Wire and Die Bonding for Hybrid Circuits
title_full	Remarks on Wire and Die Bonding for Hybrid Circuits
title_fullStr	Remarks on Wire and Die Bonding for Hybrid Circuits
title_full_unstemmed	Remarks on Wire and Die Bonding for Hybrid Circuits
title_sort	remarks on wire and die bonding for hybrid circuits
publisher	Hindawi Limited
series	Active and Passive Electronic Components
issn	0882-7516 1563-5031
publishDate	1977-01-01
url	http://dx.doi.org/10.1155/APEC.4.157
work_keys_str_mv	AT asoffa remarksonwireanddiebondingforhybridcircuits
_version_	1726003867527675904

Similar Items