3D printing path planning algorithm for thin walled and complex devices

• Main Authors: Yang Min, Lai Menggang, Liu Shengjun
• Format: Article
• Language: English
• Published: De Gruyter 2021-07-01
• Series: Science and Engineering of Composite Materials
• Subjects: 3d printing; path planning; potential field method; balanced stress
• Online Access: https://doi.org/10.1515/secm-2021-0032

With the popularity of stereo printing technology, 3D printers are widely used in industry, manufacturing, medicine, and other industries to quickly manufacture small devices. Before 3D printing, it is necessary to plan the printing path. Unreasonable printing path will not only increase the time consumption of printing products, but also cause printing failure due to the accumulation of stress and deformation in the printing process. In order to overcome the superimposed stress and deformation in the process of printing thin-walled complex devices, this article introduces the idea of balanced stress based on the basic damage of the path planning based on the potential field method. In the printing process, the ring path, island path and cross path are added to overcome the stress deformation phenomenon and improve the printing quality. Finally, the 3D printer is used to manufacture thin-walled complex devices, and the feasibility of the balanced potential field method is verified by physical comparison.