Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method
In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints. Tensile strength, be...
Main Authors: | Pushkaraj D. Sonawane, V. K. Bupesh Raja, Manoj Gupta |
---|---|
Format: | Article |
Language: | English |
Published: |
Hindawi Limited
2020-01-01
|
Series: | Advances in Materials Science and Engineering |
Online Access: | http://dx.doi.org/10.1155/2020/7612186 |
Similar Items
-
Contamination of potable water by corrosion of tin-lead soldered joints
by: Oliphant, R. J.
Published: (1983) -
Interfacial reaction and joint strength of In-Bi solder on Cu substrate
by: Jeng-Yu Chiang, et al.
Published: (2018) -
Microstructure, mechanical performance and corrosion properties of base metal solder joints
by: Sujesh Machha, et al.
Published: (2011-01-01) -
Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging
by: Lei Sun, et al.
Published: (2015-01-01) -
Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints
by: Guo-Wei Lee, et al.
Published: (2008)