TEM observation of interfaces in a solder joint in a semiconductor device

TEM observation of interfaces in a solder joint in a semiconductor device

Microstructure of a joint between a Pb–Sn eutectic solder and an electroless Ni–8 mass% P has been examined using transmission electron microscopy. Four layers, i.e. Ni3Sn4, Ni48Sn52, Ni2SnP and Ni–20 mass% P, are formed between the solder and the electroless Ni–8 mass% P. Among them, Ni48Sn52 and N...

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Bibliographic Details
Main Author: Hirohisa Matsuki, Hiroshi Ibuka and Hiroyasu Saka
Format: Article
Language:English
Published: Taylor & Francis Group 2002-01-01
Series:Science and Technology of Advanced Materials
Online Access:http://www.iop.org/EJ/abstract/-search=58668653.26/1468-6996/3/3/A04

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