Detection and Characterization of Damage in Quasi-Static Loaded Composite Structures using Passive Thermography

• Main Authors: Joseph Zalameda, William Winfree
• Format: Article
• Language: English
• Published: MDPI AG 2018-10-01
• Series: Sensors
• Subjects: nondestructive evaluation; passive thermography; composite hat stiffened panel; quasi-static seven-point load; two-dimensional quadrupole thermal model; matrix crack; delamination damage depth; fracture heating
• Online Access: http://www.mdpi.com/1424-8220/18/10/3562

Real-time nondestructive evaluation is critical during composites load testing. Of particular importance is the real time measurement of damage onset, growth, and ultimate failure. When newly formed damage is detected, the loading is stopped for further detailed characterization using ultrasound inspections or X-ray computed tomography. This detailed inspection data are used to document failure modes and ultimately validate damage prediction models. Passive thermography is used to monitor heating from damage formation in a hat-stiffened woven graphite epoxy composite panel during quasi-static seven-point load testing. Data processing techniques are presented that enable detection of the small transient thermographic signals resulting from damage formation in real time. It has been observed that the temperature rise due to damage formation at the surface is composed of two thermal responses. The first response is instantaneous and conforms to the shape of the damage. This heating is most likely due to irreversible thermoelastic, plastic deformation, and microstructural heating. The second response is a transient increase in temperature due to mechanical heating at the interface of failure. Two-dimensional multi-layered thermal simulations based on quadrupole method are used to investigate the thermal responses. In particular, the instantaneous response is used as the transient response start time to determine damage depth. The passive thermography measurement results are compared to ultrasonic measurements for validation.