Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-07-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/10/7/934 |