Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
Poly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behav...
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doaj-68a02994301d41a8a3a9c18bdfd866742020-11-24T22:09:12ZzhoJournal of Materials EngineeringJournal of Materials Engineering1001-43811001-43812018-10-01461014915510.11868/j.issn.1001-4381.2017.000385201810000385Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) ResinGE Juan0SAILIKE Danibai1ZHOU Quan2PENG Zheng-qiang3NI Li-zhong4Key Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaProduct Quality Inspection Institute in Kazak Autonomous Prefecture, Yining 835800, Xinjiang, ChinaKey Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaKey Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaKey Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaPoly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behavior was analyzed by DSC and rheometer, and heat performance was measured by TGA. The study shows that heat-resistant of resins first increases and then decrease with the increase of mole ratio of phenylsilane and methylsilane. When the mole ratio comes to 7:4, PDMP's heat-resistant is the best. And the <i>T</i><sub>d5</sub> (5% mass loss temperature) and residual are respectively 654℃ and 90.3% in N<sub>2</sub>, 574℃ and 34.0% in air after 1000℃. http://jme.biam.ac.cn/CN/Y2018/V46/I10/149 mole ratiosilicon-alkyne resincuringheat-resistant |
collection |
DOAJ |
language |
zho |
format |
Article |
sources |
DOAJ |
author |
GE Juan SAILIKE Danibai ZHOU Quan PENG Zheng-qiang NI Li-zhong |
spellingShingle |
GE Juan SAILIKE Danibai ZHOU Quan PENG Zheng-qiang NI Li-zhong Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin Journal of Materials Engineering mole ratio silicon-alkyne resin curing heat-resistant |
author_facet |
GE Juan SAILIKE Danibai ZHOU Quan PENG Zheng-qiang NI Li-zhong |
author_sort |
GE Juan |
title |
Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin |
title_short |
Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin |
title_full |
Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin |
title_fullStr |
Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin |
title_full_unstemmed |
Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin |
title_sort |
synthesis and properties of high temperature resistant poly (m-diethynylbenzene-methylsilane-phenylsilane) resin |
publisher |
Journal of Materials Engineering |
series |
Journal of Materials Engineering |
issn |
1001-4381 1001-4381 |
publishDate |
2018-10-01 |
description |
Poly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behavior was analyzed by DSC and rheometer, and heat performance was measured by TGA. The study shows that heat-resistant of resins first increases and then decrease with the increase of mole ratio of phenylsilane and methylsilane. When the mole ratio comes to 7:4, PDMP's heat-resistant is the best. And the <i>T</i><sub>d5</sub> (5% mass loss temperature) and residual are respectively 654℃ and 90.3% in N<sub>2</sub>, 574℃ and 34.0% in air after 1000℃. |
topic |
mole ratio silicon-alkyne resin curing heat-resistant |
url |
http://jme.biam.ac.cn/CN/Y2018/V46/I10/149
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work_keys_str_mv |
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1725813036163268608 |