Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin

Poly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behav...

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Main Authors: GE Juan, SAILIKE Danibai, ZHOU Quan, PENG Zheng-qiang, NI Li-zhong
Format: Article
Language:zho
Published: Journal of Materials Engineering 2018-10-01
Series:Journal of Materials Engineering
Subjects:
Online Access: http://jme.biam.ac.cn/CN/Y2018/V46/I10/149
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spelling doaj-68a02994301d41a8a3a9c18bdfd866742020-11-24T22:09:12ZzhoJournal of Materials EngineeringJournal of Materials Engineering1001-43811001-43812018-10-01461014915510.11868/j.issn.1001-4381.2017.000385201810000385Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) ResinGE Juan0SAILIKE Danibai1ZHOU Quan2PENG Zheng-qiang3NI Li-zhong4Key Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaProduct Quality Inspection Institute in Kazak Autonomous Prefecture, Yining 835800, Xinjiang, ChinaKey Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaKey Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaKey Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, East China University of Science and Technology, Shanghai 200237, ChinaPoly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behavior was analyzed by DSC and rheometer, and heat performance was measured by TGA. The study shows that heat-resistant of resins first increases and then decrease with the increase of mole ratio of phenylsilane and methylsilane. When the mole ratio comes to 7:4, PDMP's heat-resistant is the best. And the <i>T</i><sub>d5</sub> (5% mass loss temperature) and residual are respectively 654℃ and 90.3% in N<sub>2</sub>, 574℃ and 34.0% in air after 1000℃. http://jme.biam.ac.cn/CN/Y2018/V46/I10/149 mole ratiosilicon-alkyne resincuringheat-resistant
collection DOAJ
language zho
format Article
sources DOAJ
author GE Juan
SAILIKE Danibai
ZHOU Quan
PENG Zheng-qiang
NI Li-zhong
spellingShingle GE Juan
SAILIKE Danibai
ZHOU Quan
PENG Zheng-qiang
NI Li-zhong
Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
Journal of Materials Engineering
mole ratio
silicon-alkyne resin
curing
heat-resistant
author_facet GE Juan
SAILIKE Danibai
ZHOU Quan
PENG Zheng-qiang
NI Li-zhong
author_sort GE Juan
title Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
title_short Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
title_full Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
title_fullStr Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
title_full_unstemmed Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin
title_sort synthesis and properties of high temperature resistant poly (m-diethynylbenzene-methylsilane-phenylsilane) resin
publisher Journal of Materials Engineering
series Journal of Materials Engineering
issn 1001-4381
1001-4381
publishDate 2018-10-01
description Poly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behavior was analyzed by DSC and rheometer, and heat performance was measured by TGA. The study shows that heat-resistant of resins first increases and then decrease with the increase of mole ratio of phenylsilane and methylsilane. When the mole ratio comes to 7:4, PDMP's heat-resistant is the best. And the <i>T</i><sub>d5</sub> (5% mass loss temperature) and residual are respectively 654℃ and 90.3% in N<sub>2</sub>, 574℃ and 34.0% in air after 1000℃.
topic mole ratio
silicon-alkyne resin
curing
heat-resistant
url http://jme.biam.ac.cn/CN/Y2018/V46/I10/149
work_keys_str_mv AT gejuan synthesisandpropertiesofhightemperatureresistantpolymdiethynylbenzenemethylsilanephenylsilaneresin
AT sailikedanibai synthesisandpropertiesofhightemperatureresistantpolymdiethynylbenzenemethylsilanephenylsilaneresin
AT zhouquan synthesisandpropertiesofhightemperatureresistantpolymdiethynylbenzenemethylsilanephenylsilaneresin
AT pengzhengqiang synthesisandpropertiesofhightemperatureresistantpolymdiethynylbenzenemethylsilanephenylsilaneresin
AT nilizhong synthesisandpropertiesofhightemperatureresistantpolymdiethynylbenzenemethylsilanephenylsilaneresin
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