Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers

Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers

Shape memory polymers (SMPs) are attracting attention for their use in wearable displays and biomedical materials due to their good biocompatibility and excellent moldability. SMPs also have the advantage of being lightweight with excellent shape recovery due to their low density. However, they have...

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Bibliographic Details
Main Authors: Mijeong Kim, Seongeun Jang, Sungwoong Choi, Junghoon Yang, Jungpil Kim, Duyoung Choi
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Micromachines
Subjects:
shape memory polymer
thermal conductive filler
shape recovery rate
thermal conductivity
curing condition
Online Access:https://www.mdpi.com/2072-666X/12/9/1107

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