Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI
Prognostic of electronic device under vibration condition can help to get information to assist in condition-based maintenance and reduce life-cycle cost. A prognostic and remaining life prediction method for electronic devices under random vibration condition is proposed. Vibration response is meas...
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2016-01-01
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Series: | Shock and Vibration |
Online Access: | http://dx.doi.org/10.1155/2016/2650569 |
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doaj-64fe4f44826e4fc0899254db05390c1b2020-11-24T21:30:00ZengHindawi LimitedShock and Vibration1070-96221875-92032016-01-01201610.1155/2016/26505692650569Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPIYing Chen0Ning Tang1Zenghui Yuan2Science and Technology on Reliability and Environmental Engineering Laboratory, Reliability and System Engineering Department, Beihang University, Beijing 100191, ChinaScience and Technology on Reliability and Environmental Engineering Laboratory, Reliability and System Engineering Department, Beihang University, Beijing 100191, ChinaScience and Technology on Reliability and Environmental Engineering Laboratory, Reliability and System Engineering Department, Beihang University, Beijing 100191, ChinaPrognostic of electronic device under vibration condition can help to get information to assist in condition-based maintenance and reduce life-cycle cost. A prognostic and remaining life prediction method for electronic devices under random vibration condition is proposed. Vibration response is measured and monitored with acceleration sensor and OMA parameters, including vibration resonance frequency, especially first-order resonance frequency, and damping ratio is calculated with cross-power spectrum density (CPSD) method and modal parameter identification (MPI) algorithm. Steinberg vibration fatigue model which considers transmissibility factor is used to predict the remaining life of electronic component. Case study with a test board is carried out and remaining life is predicted. Results show that with this method the vibration response characteristic can be monitored and predicted.http://dx.doi.org/10.1155/2016/2650569 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Ying Chen Ning Tang Zenghui Yuan |
spellingShingle |
Ying Chen Ning Tang Zenghui Yuan Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI Shock and Vibration |
author_facet |
Ying Chen Ning Tang Zenghui Yuan |
author_sort |
Ying Chen |
title |
Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI |
title_short |
Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI |
title_full |
Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI |
title_fullStr |
Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI |
title_full_unstemmed |
Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI |
title_sort |
prognostic and remaining life prediction of electronic device under vibration condition based on cpsd of mpi |
publisher |
Hindawi Limited |
series |
Shock and Vibration |
issn |
1070-9622 1875-9203 |
publishDate |
2016-01-01 |
description |
Prognostic of electronic device under vibration condition can help to get information to assist in condition-based maintenance and reduce life-cycle cost. A prognostic and remaining life prediction method for electronic devices under random vibration condition is proposed. Vibration response is measured and monitored with acceleration sensor and OMA parameters, including vibration resonance frequency, especially first-order resonance frequency, and damping ratio is calculated with cross-power spectrum density (CPSD) method and modal parameter identification (MPI) algorithm. Steinberg vibration fatigue model which considers transmissibility factor is used to predict the remaining life of electronic component. Case study with a test board is carried out and remaining life is predicted. Results show that with this method the vibration response characteristic can be monitored and predicted. |
url |
http://dx.doi.org/10.1155/2016/2650569 |
work_keys_str_mv |
AT yingchen prognosticandremaininglifepredictionofelectronicdeviceundervibrationconditionbasedoncpsdofmpi AT ningtang prognosticandremaininglifepredictionofelectronicdeviceundervibrationconditionbasedoncpsdofmpi AT zenghuiyuan prognosticandremaininglifepredictionofelectronicdeviceundervibrationconditionbasedoncpsdofmpi |
_version_ |
1725964586074505216 |