Seeking advanced thermal management for stretchable electronics
Abstract With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For pa...
Main Authors: | Bin Sun, Xingyi Huang |
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Format: | Article |
Language: | English |
Published: |
Nature Publishing Group
2021-06-01
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Series: | npj Flexible Electronics |
Online Access: | https://doi.org/10.1038/s41528-021-00109-9 |
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