Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized...

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Bibliographic Details
Main Authors: Yi Wang, Wei Wu, Dietmar Drummer, Chao Liu, Wanting Shen, Florian Tomiak, Kevin Schneider, Xingrong Liu, Qiming Chen
Format: Article
Language:English
Published: Elsevier 2020-06-01
Series:Materials & Design
Subjects:
Hybrid filler
Thermal conductivity
Contact resistance
Boron nitride
Polybenzoxazine
Online Access:http://www.sciencedirect.com/science/article/pii/S026412752030232X
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spelling doaj-63c38f65c7ec4df0b22afdfded0b58df2020-11-25T03:03:50ZengElsevierMaterials & Design0264-12752020-06-01191Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particlesYi Wang0Wei Wu1Dietmar Drummer2Chao Liu3Wanting Shen4Florian Tomiak5Kevin Schneider6Xingrong Liu7Qiming Chen8Sino-German Joint Research Centre of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, PR ChinaSino-German Joint Research Centre of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, PR China; Corresponding authors.Institute of Polymer Technology, Friedrich Alexander University Erlangen-Nuremberg, 91058 Erlangen, Germany; Corresponding authors.Sino-German Joint Research Centre of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, PR ChinaSino-German Joint Research Centre of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, PR ChinaInstitute of Polymer Technology, Friedrich Alexander University Erlangen-Nuremberg, 91058 Erlangen, GermanyInstitute of Polymer Technology, Friedrich Alexander University Erlangen-Nuremberg, 91058 Erlangen, GermanySino-German Joint Research Centre of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, PR ChinaSino-German Joint Research Centre of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, PR ChinaTo solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized. A specific BN@Cu hybrid filler (mBN:mCu = 100:2), labeled as BN@2Cu, exhibited remarkable ability in enhancing the thermal conductivity of polybenzoxazine (PBz) composites fabricated through ball milling followed by hot pressing. With 25 wt% of BN@2Cu hybrid fillers, the thermal conductivity of PBz composites reaches 1.049 W m−1 K−1. Dielectric properties, electrical conductivity, and curing behavior of the composites were also investigated. In addition, Foygel's thermal conduction model was employed to demonstrate the mechanism of BN@2Cu hybrid filler in improving thermal conductivity.http://www.sciencedirect.com/science/article/pii/S026412752030232XHybrid fillerThermal conductivityContact resistanceBoron nitridePolybenzoxazine
collection DOAJ
language English
format Article
sources DOAJ
author Yi Wang
Wei Wu
Dietmar Drummer
Chao Liu
Wanting Shen
Florian Tomiak
Kevin Schneider
Xingrong Liu
Qiming Chen
spellingShingle Yi Wang
Wei Wu
Dietmar Drummer
Chao Liu
Wanting Shen
Florian Tomiak
Kevin Schneider
Xingrong Liu
Qiming Chen
Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
Materials & Design
Hybrid filler
Thermal conductivity
Contact resistance
Boron nitride
Polybenzoxazine
author_facet Yi Wang
Wei Wu
Dietmar Drummer
Chao Liu
Wanting Shen
Florian Tomiak
Kevin Schneider
Xingrong Liu
Qiming Chen
author_sort Yi Wang
title Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
title_short Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
title_full Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
title_fullStr Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
title_full_unstemmed Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
title_sort highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
publisher Elsevier
series Materials & Design
issn 0264-1275
publishDate 2020-06-01
description To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized. A specific BN@Cu hybrid filler (mBN:mCu = 100:2), labeled as BN@2Cu, exhibited remarkable ability in enhancing the thermal conductivity of polybenzoxazine (PBz) composites fabricated through ball milling followed by hot pressing. With 25 wt% of BN@2Cu hybrid fillers, the thermal conductivity of PBz composites reaches 1.049 W m−1 K−1. Dielectric properties, electrical conductivity, and curing behavior of the composites were also investigated. In addition, Foygel's thermal conduction model was employed to demonstrate the mechanism of BN@2Cu hybrid filler in improving thermal conductivity.
topic Hybrid filler
Thermal conductivity
Contact resistance
Boron nitride
Polybenzoxazine
url http://www.sciencedirect.com/science/article/pii/S026412752030232X
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