IMPROVEMENT OF POWER SUPPLY OUTPUT VOLTAGE TEMPERATURE STABILITY BY MEANS OF ANISOTROPY OF ITS CONSTRUCTION THERMAL FIELD

• Main Authors: Denis V. Ozerkin, Arseniy O. Chulkov
• Format: Article
• Language: Russian
• Published: Saint Petersburg Electrotechnical University "LETI" 2018-10-01
• Series: Известия высших учебных заведений России: Радиоэлектроника
• Subjects: electronic device; electrical part; temperature stability; topological thermocompensation; circuit simulator; spice model; factor experiment; regression analysis; temperature error equation
• Online Access: https://re.eltech.ru/jour/article/view/255

The article considers the method of thermal stabilization for precision power supply output voltage by means of anisotropy of the construction thermal field. Interdependency between schematic and design-topological aspects of precision power supply temperature assurance is shown. In theoretical part of the paper, the concept of electronic component local group arranged on isothermal line of the supporting structure plane is introduced. The local group characteristics and conditions for ensuring topological thermocompensation are formulated. The authors propose the solution for two basic applied problems that provides temperature stabilization of electronic devices output parameters by topological temperature compensation using regression analysis. The experimental part of the paper provides the analysis of the output voltage temperature stability for two design versions which differ by availability of topological thermocompensation. The reason of foreign element base use for the purposes of the experimental part of the study is explained. It is shown that the global mathematical model for providing topological thermocompensation for a design option with improved temperature stability is the temperature error equation. A comparative analysis of the two construction options shows 8 % improvement of output voltage temperature stability due to topological thermocompensation. The obtained result may prove to be satisfactory under technical assignment for the use of a different element base and / or other methods of thermal stabilization.