Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images

Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images

Normally the optical wafer inspection tools are used for advanced process control in high volume manufacturing of semiconductor devices. The SEM Review is done for limited sample of inspection defects to do defect based process characterization. The defect classes that are monitored normally indicat...

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Bibliographic Details
Main Authors: Yu Zhang, Abhishek Vikram, Ming Tian, Tianpeng Guan, Jianghua Leng, Baojun Zhao, Lei Yan, Wei Hu, Guojie Chen, Hui Wang, Gary Zhang, Wenkui Liao
Format: Article
Language:English
Published: JommPublish 2019-06-01
Series:Journal of Microelectronic Manufacturing
Subjects:
die-to-database pattern monitor
after develop inspection (adi)
after etch inspection (aei)
sem review
cdsem
pattern centric
pattern monitor
Online Access:http://www.jommpublish.org/p/28/#

Internet

http://www.jommpublish.org/p/28/#

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