Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images

• Main Authors: Yu Zhang, Abhishek Vikram, Ming Tian, Tianpeng Guan, Jianghua Leng, Baojun Zhao, Lei Yan, Wei Hu, Guojie Chen, Hui Wang, Gary Zhang, Wenkui Liao
• Format: Article
• Language: English
• Published: JommPublish 2019-06-01
• Series: Journal of Microelectronic Manufacturing
• Subjects: die-to-database pattern monitor; after develop inspection (adi); after etch inspection (aei); sem review; cdsem; pattern centric; pattern monitor
• Online Access: http://www.jommpublish.org/p/28/#

Normally the optical wafer inspection tools are used for advanced process control in high volume manufacturing of semiconductor devices. The SEM Review is done for limited sample of inspection defects to do defect based process characterization. The defect classes that are monitored normally indicate process and random defect issues. There is limited to no information of patterning related issues in real time defect monitor. Moreover, with the objective of process integration engineering of multiple processes it becomes harder to see the evolution of a defect in the line. The Die-to-Database Pattern Monitor (D2DB-PM) solution has addressed this problem. It uses the existing high resolution images from the Review and Metrology tools and compares the pattern shapes with the design reference. This way it captures patterning deviations in real time. Here we report the subtle defect problem encountered in process integration and the results from using the D2DB-PM solution. We found that this approach reduces the workload on CDSEM tools by analyzing SEM Review images instead and the automated reports improves the efficiency of all process teams.