TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement
In this paper, we present a TSV low-bandwidth equivalent lumped circuit model of common TSV defects as analyzed using a high-frequency structure simulator 3-D full wave simulation. By using the proposed model, the physical parameters of TSV are related to its electrical parameters, providing the pos...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2018-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8525271/ |