Degradation Monitoring of Insulation Systems Used in Low-Voltage Electromagnetic Coils under Thermal Loading Conditions from a Creep Point of View

• Main Authors: Kai Wang, Haifeng Guo, Aidong Xu, Michael Pecht
• Format: Article
• Language: English
• Published: MDPI AG 2020-07-01
• Series: Sensors
• Subjects: electromagnetic coil; insulation degradation monitoring; high-frequency electrical parameter; creep deformation; accelerated testing
• Online Access: https://www.mdpi.com/1424-8220/20/13/3696

Electromagnetic coils are a key component in a variety of systems and are widely used in many industries. Because their insulation usually fails suddenly and can have catastrophic effects, degradation monitoring of coil insulation systems plays a vital role in avoiding unexpected machine shutdown. The existing insulation degradation monitoring methods are based on assessing the change of coil high-frequency electrical parameter response, whereas the effects of the insulation failure mechanisms are not considered, which leads to inconsistency between experimental results. Therefore, this paper investigates degradation monitoring of coil insulation systems under thermal loading conditions from a creep point of view. Inter-turn insulation creep deformation is identified as a quantitative index to manifest insulation degradation changes at the micro level. A method is developed to map coil high-frequency electrical monitoring parameters to inter-turn insulation creep deformation in order to bridge the gap between the micro-level and macro-level changes during the incipient insulation degradation process. Thermally accelerated tests are performed to validate the developed method. The mapping method helps to determine the physical meaning of coil electrical monitoring parameters and presents opportunities for predictive maintenance of machines that incorporate electromagnetic coils.