Tensile strengths and Young’s modulus of thin copper and copper-nickel (CuNi44) substrates

Tensile strengths and Young’s modulus of thin copper and copper-nickel (CuNi44) substrates

Bibliographic Details
Main Authors:	Staller Oliver, Mitterbauer Christina, Mayr Katharina
Format:	Article
Language:	English
Published:	De Gruyter 2008-12-01
Series:	Open Chemistry
Subjects:	tensile strength vickers hardness textured tapes cu substrates coated conductors
Online Access:	https://doi.org/10.2478/s11532-008-0076-6

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